Leaked iPhone 6 Parts Show Logic Board Assembly
iPhone 6 images and iPhone 6 part images continue to circulate. A recent one from AppleClub, a Taiwanese site, shows the complete logic board assemblies. While most of the components are hidden beneath shielding, we do learn a few small things.
New iPhone parts pictures from AppleClub.
For one, it seems like the flash memory chip, seen in the middle left, is made by Toshiba. The A8 chip that will be used in the iPhone 6 will likely be positioned beneath the shielding on the right, above the SIM card slot.
This photo confirms other photos that showed tapered edges on the display panel. It also adds to other photo leaks, which suggested that the power button has moved from the top to the side of the phone. It is also said that there will be a raised camera cutout, and a single, circular True Tone flash.
The next gen iPhone is expected to be announced officially by Apple on September 9th.
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